Advanced Packaging

The advanced packaging team groups all research projects related to realizing an electrical connection between the chip and a substrate. These substrates range from traditional printed circuit boards to flexible polyimide or polyester foils. The chips are either mounted on top of the substrate or embedded into the substrate.

Thanks to its long history of research into PCB manufacturing and assembly, a strong competence has been built for processing and evaluating electronic systems. This know-how is also applied to cost and yield modelling as well as high-frequency characterization.

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