Optical Microsystems

CMST is creating solutions for the photonics packaging challenges in datacom, telecom and sensing. We are developing technologies to facilitate interfacing of photonic integrated circuits both optically (integration of optical coupling structures) and electrically (integration of drivers).

In addition, CMST has built up a technology platform allowing integration of optical waveguides, coupling structures, light sources, detectors, and electronic circuitry on rigid, flexible, and stretchable substrates targeting a number of (medical) sensing applications.

Laser technology has since long been an important competence, and the group has several laser systems at its disposal: a KrF Excimer laser, ND YAG laser and CO2 laser for drilling microvias and structuring materials and a picosecond and femtosecond laser for advanced material processing and glass modification.

Selection of recent work :


Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits.
"A. Desmet, A. Radosavljević, J. Missinne, D. Van Thourhout and G. Van Steenberge, "Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits," in IEEE Photonics Journal, vol. 13, no. 1, pp. 1-12, Feb. 2021, doi: 10.1109/JPHOT.2020.3039900."

Femtosecond laser-inscribed non-volatile integrated optical switch in fused silica based on microfluidics-controlled total internal reflection.
Radosavljevic A, Desmet A, Missinne J, Saurav K, Panapakkam V, Tuccio S, et al. Femtosecond laser-inscribed non-volatile integrated optical switch in fused silica based on microfluidics-controlled total internal reflection. JOURNAL OF LIGHTWAVE TECHNOLOGY. 2020;38(15):3965–73.


Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly.
“Elmogi, A., Ramon, H., Lambrecht, J., Ossieur, P., Torfs, G., Missinne, J., De Heyn, P., et al. (2018).  IEEE Photonics Technology Letters, 30(22), 1944–1947.”


Aerosol-jet printed interconnects for 2.5 D electronic and photonic integration.
“Elmogi, A., Soenen, W., Ramon, H., Yin, X., Missinne, J., Spiga, S., Amann, M.-C., et al. (2018). JOURNAL OF LIGHTWAVE TECHNOLOGY, 36(16), 3528–3533.”


Alignment-tolerant Interfacing of a Photonic Integrated Circuit Using Back Side Etched Silicon Microlenses.
“Missinne, J., Beneitez, N. T., Mangal, N., Zhang, J., Vasiliev, A., Van Campenhout, J., Snyder, B., Roelkens, G., and Van Steenberge, G., Alignment-tolerant interfacing of a photonic integrated circuit using back-side etched silicon microlenses, in Silicon Photonics XIV, 10923, International Society for Optics and Photonics (2019).”

Back-side emitted grating couplers
Mangal N, Missinne J, Van Steenberge G, Van Campenhout J, Snyder B. Performance evaluation of backside emitting O-Band grating couplers for 100 μm-thick silicon photonics interposers. IEEE PHOTONICS JOURNAL . Institute of Electrical and Electronics Engineers (IEEE); 2019;11(3):1–1.


Single-mode polymer optical waveguides using laser-direct write technology
“Elmogi, A., Bosman, E., Missinne, J., & Van Steenberge, G. (2016). Comparison of epoxy- and siloxane-based single-mode optical waveguides defined by direct-write lithography. OPTICAL MATERIALS, 52, 26–31.”

Single-mode polymer optical waveguides using imprinting (for sensing)
“Missinne, Jeroen, Nuria Teigell Beneitez, Marie-Aline Mattelin, Alfredo Lamberti, Geert Luyckx, Wim Van Paepegem, and Geert Van Steenberge. 2018. Sensors 18 (8): 2717–1–2717–14.”


Ultrathin optoelectronic device packaging in flexible carriers.
“Bosman, E., Missinne, J., Van Hoe, B., Van Steenberge, G., Kalathimekkad, S., Van Erps, J., Milenkov, I., et al. (2011). IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 17(3), 617–628.”


Stretchable optical waveguide demonstrator including embedded VCSELs and photodiodes integrated with PDMS multimode waveguides.
“Missinne, J., Kalathimekkad, S., Van Hoe, B., Bosman, E., Vanfleteren, J., & Van Steenberge, G. (2014). Stretchable optical waveguides. OPTICS EXPRESS, 22(4), 4168–4179.”


Bragg-Grating-Based Photonic Strain and Temperature Sensor Foils Realized Using Imprinting and Operating at Very Near Infrared Wavelengths.
“Missinne, Jeroen, Nuria Teigell Beneitez, Marie-Aline Mattelin, Alfredo Lamberti, Geert Luyckx, Wim Van Paepegem, and Geert Van Steenberge. 2018. Sensors 18 (8): 2717–1–2717–14.”

Thin and Flexible Polymer Photonic Sensor Foils for Monitoring Composite Structures.
“Missinne, Jeroen, Nuria Teigell Beneitez, Alfredo Lamberti, Gabriele Chiesura, Geert Luyckx, Marie-Aline Mattelin, Wim Van Paepegem, and Geert Van Steenberge. 2018. Advanced Engineering Materials 20 (2).”

Fine-pitch blazed gratings (cross-sectional view)

Design and fabrication of blazed gratings for a waveguide-type head mounted display.
"Mattelin, M.-A., Radosavljevic, A., Missinne, J., Cuypers, D., & Van Steenberge, G. (2020). OPTICS EXPRESS28(8), 11175–11190. https://doi.org/10.1364/oe.384806"

Imprinted polymer-based guided mode resonance grating strain sensors.
Mattelin, M.-A., Missinne, J., De Coensel, B., & Van Steenberge, G. (2020). 
SENSORS20(11). https://doi.org/10.3390/s20113221


Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer.
“Kaur K, Missinne J, Van Steenberge G. APPLIED PHYSICS LETTERS. 2014;104(6).”


Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms.
“Kaur K, Subramanian A, Cardile P, Verplancke R, Van Kerrebrouck J, Spiga S, et al. OPTICS EXPRESS. 2015;23(22):28264–70.”


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