Photonics packaging and sensors technologies (Printed Photonics Team)

Over the past years, CMST has built up a technology and packaging platform allowing integration of optical waveguides, coupling structures, light sources, detectors, and electronic circuitry on rigid, flexible, and stretchable substrates.

Through the involvement in various research projects, this platform is being developed in different applications, including printed circuit board-level optical interconnects (EU-FP7 project FIREFLY), active optical cable assemblies (EU-FP7 project MIRAGE), multi-axial strain sensing (IWT-SBO project self-sensing composites), and biosensing (EU-FP7 project NEXTDX).

One of the core competences of CMST has been laser processing, which evolved from a basic technology for drilling microvias, to an enabling technology for complex microsystems, with developments in self-written waveguides for fiber-to-fiber connectivity (IWT O&O project EP2CON), in thin-film organics patterning (cooperation Holst Centre), in mid-infrared resonant ablation (EU-FP7 project IMPROV), in laser-induced forward transfer (LIFT), and in femtosecond laser waveguide writing.

Recent Publications :


Femtosecond-laser inscription in glass: low-loss single mode waveguides and precision alignment features.
“Desmet, Andres, Radosavljevic, A., Missinne, J., Van Thourhout, D., & Van Steenberge, G. (2018). Laser printed glass planar lightwave circuits with integrated fiber alignment structures. OPTICAL INTERCONNECTS XVIII (Vol. 10538). Presented at the Conference on Optical Interconnects XVIII , SPIE.”


Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly.
“Elmogi, A., Ramon, H., Lambrecht, J., Ossieur, P., Torfs, G., Missinne, J., De Heyn, P., et al. (2018). Aerosol-Jet Printed Interconnects for 60-Gb/s CMOS Driver and Microring Modulator Transmitter Assembly. IEEE Photonics Technology Letters, 30(22), 1944–1947.”


Aerosol-jet printed interconnects for 2.5 D electronic and photonic integration.
“Elmogi, A., Soenen, W., Ramon, H., Yin, X., Missinne, J., Spiga, S., Amann, M.-C., et al. (2018). Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration. JOURNAL OF LIGHTWAVE TECHNOLOGY, 36(16), 3528–3533.”


Monolithically integrated silicon microlenses for efficient and alignment-tolerant coupling from/to photonic chips.(publication pending)
“Missinne, J., Benitez, N. T., Mangal, N., Zhang, J., Vasiliev, A., Van Campenhout, J., Snyder, B., Roelkens, G., and Van Steenberge, G., Alignment-tolerant interfacing of a photonic integrated circuit using back-side etched silicon microlenses, in Silicon Photonics XIV, 10923, International Society for Optics and Photonics (2019).”


Single-mode polymer optical waveguides (down to 1x1 μm2) on large-area substrates using laser-direct write technology or imprinting.
“Elmogi, A., Bosman, E., Missinne, J., & Van Steenberge, G. (2016). Comparison of epoxy- and siloxane-based single-mode optical waveguides defined by direct-write lithography. OPTICAL MATERIALS, 52, 26–31.”


Embedding of VCSEL and photodiode chips in ultra-thin polymer packages.
“Bosman, E., Missinne, J., Van Hoe, B., Van Steenberge, G., Kalathimekkad, S., Van Erps, J., Milenkov, I., et al. (2011). Ultrathin optoelectronic device packaging in flexible carriers. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 17(3), 617–628.”


Stretchable optical interconnect demonstrator including embedded VCSELs and photodiodes integrated with PDMS multimode waveguides.
“Missinne, J., Kalathimekkad, S., Van Hoe, B., Bosman, E., Vanfleteren, J., & Van Steenberge, G. (2014). Stretchable optical waveguides. OPTICS EXPRESS, 22(4), 4168–4179.”


Bragg-Grating-Based Photonic Strain and Temperature Sensor Foils Realized Using Imprinting and Operating at Very Near Infrared Wavelengths.
“Missinne, Jeroen, Nuria Teigell Beneitez, Marie-Aline Mattelin, Alfredo Lamberti, Geert Luyckx, Wim Van Paepegem, and Geert Van Steenberge. 2018. Sensors 18 (8): 2717–1–2717–14.”

Thin and Flexible Polymer Photonic Sensor Foils for Monitoring Composite Structures.
“Missinne, Jeroen, Nuria Teigell Beneitez, Alfredo Lamberti, Gabriele Chiesura, Geert Luyckx, Marie-Aline Mattelin, Wim Van Paepegem, and Geert Van Steenberge. 2018. Advanced Engineering Materials 20 (2).”


GMR Publication: An imprinted polymer-based guided mode resonance grating sensor.


Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer.
“Kaur K, Missinne J, Van Steenberge G. Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer. APPLIED PHYSICS LETTERS. 2014;104(6).”


Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms.
“Kaur K, Subramanian A, Cardile P, Verplancke R, Van Kerrebrouck J, Spiga S, et al. OPTICS EXPRESS. 2015;23(22):28264–70.”


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