High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality of modern integrated circuits. The combination of a high number of I/Os with a reduced pitch places additional demands onto the PCB, requiring the use of laser drilled microvias, high aspect ratio core vias and small track width and spacing. While the associated advanced manufacturing processes have been widely used in commercial, automotive, medical and military applications; reconciling these advancements in capability with the reliability requirements for space remains a challenge. The goal of the project is to design, evaluate and qualify HDI PCBs that are capable of providing a platform for assembly and the routing of small pitch AAD for space projects. The assembly of HDI components on HDI PCBs will be verified and test methodology for the assessment of the reliability of the HDI technology will be developed.