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Aerosol-jet printed (AJP) high-speed chip-to-chip interconnects

EAM

Aerosol-Jet printed interconnects for 60-Gb/s CMOS driver and microring modulator transmitter assembly.
“Elmogi, A., Ramon, H., Lambrecht, J., Ossieur, P., Torfs, G., Missinne, J., De Heyn, P., et al. (2018).  IEEE Photonics Technology Letters, 30(22), 1944–1947.”

AJP

Aerosol-jet printed interconnects for 2.5 D electronic and photonic integration.
“Elmogi, A., Soenen, W., Ramon, H., Yin, X., Missinne, J., Spiga, S., Amann, M.-C., et al. (2018). JOURNAL OF LIGHTWAVE TECHNOLOGY, 36(16), 3528–3533.”