Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer.
“Kaur K, Missinne J, Van Steenberge G. APPLIED PHYSICS LETTERS. 2014;104(6).”

Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms.
“Kaur K, Subramanian A, Cardile P, Verplancke R, Van Kerrebrouck J, Spiga S, et al. OPTICS EXPRESS. 2015;23(22):28264–70.”