Alignment-tolerant Interfacing of a Photonic Integrated Circuit Using Back Side Etched Silicon Microlenses.
“Missinne, J., Beneitez, N. T., Mangal, N., Zhang, J., Vasiliev, A., Van Campenhout, J., Snyder, B., Roelkens, G., and Van Steenberge, G., Alignment-tolerant interfacing of a photonic integrated circuit using back-side etched silicon microlenses, in Silicon Photonics XIV, 10923, International Society for Optics and Photonics (2019).”

Monolithic Integration of Microlenses on the Backside of a Silicon Photonics Chip for Expanded Beam Coupling
“Mangal, Nivesh, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge, and Jeroen Missinne. 2021. “Monolithic Integration of Microlenses on the Backside of a Silicon Photonics Chip for Expanded Beam Coupling.” OPTICS EXPRESS 29 (5): 7601–7615. doi:10.1364/oe.412353.”

Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics
“Mangal, Nivesh, Bradley Snyder, Joris Van Campenhout, Geert Van Steenberge, and Jeroen Missinne. 2020. “Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 26 (2). doi:10.1109/jstqe.2019.2934161.”

Back-side emitted grating couplers for use with monolithically integrated microlenses
Mangal N, Missinne J, Van Steenberge G, Van Campenhout J, Snyder B. Performance evaluation of backside emitting O-Band grating couplers for 100 μm-thick silicon photonics interposers. IEEE PHOTONICS JOURNAL . Institute of Electrical and Electronics Engineers (IEEE); 2019;11(3):1–1.