Date
Jeroen Missinne wrote:
I am happy to share our newly published paper as a result from work in the EU project "SEER" ( www.seerproject.eu ). Thank you to all co-authors and collaborators from Argotech – Semiconductor photonics and PCRL - Photonics Communications Research Laboratory !
The paper is about photonics packaging which is an important aspect if you want to turn a photonic integrated chip (PIC) into a working product.
The aim was to discuss the complete development process from PIC design to a fully packaged passive temperature sensor device that can be tested in relevant environments, also focusing on the challenges associated with MPW PICs as starting components. It will give the reader insight into several important elements to achieve a fully packaged device and motivates why a co-design of device functionality and packaging is encouraged.
Published in the new open access Journal of Optical Microsystems (JOM): https://lnkd.in/djP_Rm4v
The paper is about photonics packaging which is an important aspect if you want to turn a photonic integrated chip (PIC) into a working product.
The aim was to discuss the complete development process from PIC design to a fully packaged passive temperature sensor device that can be tested in relevant environments, also focusing on the challenges associated with MPW PICs as starting components. It will give the reader insight into several important elements to achieve a fully packaged device and motivates why a co-design of device functionality and packaging is encouraged.
Published in the new open access Journal of Optical Microsystems (JOM): https://lnkd.in/djP_Rm4v
