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Geert Van Steenberge wrote:
Our work at #imec and #GhentUniversity on interfacing silicon photonics for high-density co-packaged optics has been featured in the latest edition of Chip Scale Review!
A huge thanks to the teams at imec and Ghent University for their invaluable contributions and to Chip Scale Review for providing a platform to share our findings with the broader tech community.
A huge thanks to the teams at imec and Ghent University for their invaluable contributions and to Chip Scale Review for providing a platform to share our findings with the broader tech community.
Author = Lawrence Michaels
