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Smart Objects for IOT

In this application domain, we have the following research tracks:

  • Wearables and e-textiles:
    Conformable, wearable and mostly textile integrated sensor systems, made for capturing information of the wearer (e.g. movement, temperature,...). We mainly focus on protective, medical and sports garments.
  • Structural electronics:
    Polymer products made by lamination, thermoforming, injection moulding, etc. with integrated electronic functionality. Furthermore, polymer fabrication processes can be monitored by integrated sensors e.g. for optimization of curing, forming process etc.
  • Soft sensors:
    Dedicated developed sensors realized in soft materials e.g. pressure sensors, ECG sensors.
  • GaN technology simulation and devices.

Research Highlights

Wearables and E-Textiles

WearablesETextiles

Testing for wearability and reliability of TPU lamination method in e-textiles.
Paula Veske (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent) 
(2022) APPLIED SCIENCES-BASEL. 10(24).”

Development and washing reliability testing of a stretchable circuit on knit fabric.
“Paula Veske (UGent) , Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Tom Sterken (UGent) and Jan Vanfleteren (UGent) 
(2020) APPLIED SCIENCES-BASEL. 10(24).”

Vacuum lamination of a stretchable sensor system in polypropylene.
“Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Jan Patrick Deckers and Jan Vanfleteren (UGent) 
(2020) 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).” 

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Structural electronics

smartpolymers

The integration of electronic circuits in plastics using injection technologies : a literature review.
“Mona Bakr (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) (2022) 2022 Flexible and Printed Electronics

Solar cells integration in over-molded printed electronics.
“Mona Bakr (UGent) , Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Imen Chtioui and Wim Christiaens (2020) 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), Proceedings.”

Flexible microsystems using over-molding technology.
“Mona Bakr (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) and Yibo Su (2020) PROCEDIA MANUFACTURING. 52. p.26-31.”

Effect of overmolding process on the integrity of electronic circuits.
“Mona Bakr (UGent) , Yibo Su, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent) (2019) 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). In European Microelectronics Packaging Conference.” 

GaN technology simulation and devices

GAN

TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs.
A. N. Tallarico, M. Millesimo, Benoit Bakeroot (UGent) , M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi and C. Fiegna 
(2022) IEEE TRANSACTIONS ON ELECTRON DEVICES. 69(2). p.507-513

Schottky gate induced threshold voltage instabilities in p-GaN gate AlGaN/GaN HEMTs.
Arno Stockman (UGent) , Eleonora Canato, Matteo Meneghini, Gaudenzio Meneghesso, Peter Moens and Benoit Bakeroot (UGent) 
(2021) IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. 21(2). p.169-175

Surface-potential-based compact modeling of p-GaN gate HEMTs.
Jie Wang, Zhanfei Chen, Shuzhen You, Benoit Bakeroot (UGent) , Jun Liu and Stefaan Decoutere 
(2021) MICROMACHINES. 12(2).

Soft Sensors

No publications so far. We are working on soft pressure sensors. Contact us for more information.